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CPES2019 Innovation Awards Recognize FHE Excellence
Source:iconnect007 | Author:iconnect007 | Release time:2019-03-19 | 1317 Views | Share:
CPES2019 Innovation Awards recognize FHE excellenceThe intelliFLEX Innovation Alliance handed out some hardware at CPES2019......

CPES2019 Innovation Awards recognize FHE excellenceThe intelliFLEX Innovation Alliance handed out some hardware at CPES2019, Canada’s premier conference and trade show exhibition for printable, flexible and hybrid electronics (FHE).

CPES2019 ran from May 16-17 at Domaine Chateau-Bromont in Bromont, Que.

“At this year’s event, we wanted to put the spotlight squarely on diversity in science, technology, engineering and mathematics (STEM), in addition to the world-class innovation in flexible and hybrid electronics that’s coming out of the Canadian ecosystem,” said Mark Majewski, President and CEO of intelliFLEX and Chair of the CPES Organizing Committee. “Both award winners show the strength of Canada’s FHE ecosystem in terms of pushing research boundaries, building partnerships, and creating jobs here in Canada.”

The winner of our second Women in STEM Award is Chloé Bois.

She’s holder of the NSERC Industrial Research Chair for Colleges in Functional Printed Applications Manufacturing at College Ahuntsic, Montreal. Ms. Bois is also R&D Manager at the at the Printability and Graphic Communications Institute, Montreal, where she specializes in advanced manufacturing, printed electronics applications prototyping and developed methods to industrialize printed products manufactured by hybrid technologies as graphic printing, printed electronics and embedded standard electronics.

The winner of the first CPES2019 Business Icon of the Year Award winner is Myant Inc.

Along with recently partnering with Ryerson University to create an end-to-end textile computing lab at the school’s Faculty of Communication and Design, Myant also recently partnered with New York-based SMK Electronics Corp. USA to catalyze the development of new electronic components and mechanical interfaces for application in the emerging field of textile computing.