Multilayer

Parameters

Layers: 18

Thicknes: 3.66+0.20/-0.3 mm

Size: 462mm×614 mm

Width/Space: 0.28 mm/0.1 mm

Surface Treatment: ENIG

Crafts

Characteristic Impedance 50±5Ω

2OZ Heavy Copper

Applications

Communication






Parameters

Layers: 36

Thicknes: 8.0±0.8mm

Min. Hole Size: 0.508mm

Width/Space: 0.381mm/0.18mm

Surface Treatment: ENIG

Crafts

INNER LAYER 4OZ

ASPECT RATIO 16:1

Applications

Communication






Parameters

Layers: 32

Minimum Line Width/Clearance: 0.068mm/0.106mm

Minimum Clearance between Inner Layer PTH and Line: 0.508mm

Minimum back drilling  diameter: 0.20mm

Board Thickness: 4.415+0.46/-0.42mm

Size: 282mm×750mm

Aspect Ratio: 22

Surface treatment: OSP

Crafts

Special Process: Single-sided impedance 54Ω±10%,  Differentialimpedance 93+7/-8Ω

Applications

Communication






Parameters

Layers: 20

Thicknes: 5.55±0.4mm

Size: 477mm×516.5mm

Width/Space: 0.145mm/0.12mm

Surface Treatment: ENIG

Crafts

L8-L9, L10-L11, L12-L13 use IT180Aand they’re 3OZ heavy copper, other layers use R5775

Applications

Communication