Parameters
Layers: 8
Thicknes: 2.0±0.2mm
Min. Hole Size: 0.3mm
Width/Space: 0.121mm/0.152mm
Surface Treatment: ENIG
Crafts
Large Panel Lamination
Air-gap Structure
Applications
Industry control
Parameters
Layers: 4L(1R+2F+1R)
Thicknes: 0.65±0.10 mm
Min. Hole Size: 0.30 mm
Width/Space: 0.15mm/0.12mm
Surface Treatment: ENIG
Crafts
Black Ink
Rigid - flexible Board
Applications
Consumer electronics
Parameters
Layers: 20
Thicknes: 1.5 ±0.15mm
Surface Treatment: ENIG
Crafts
Impedance
Pressfit Hole
Counterbore
Applications
Industry control
Parameters
Layers: 18L (4R+10F+4R)
Thicknes: 2.1±0.02mm
Size: 287.88*421.05mm
Min. Distance Between Line and Width: 0.2mm/0.2mm
Min. Buried Via/PAD: 0.4mm/1.0mm
Min. Distance from Via to Line: 0.3mm
Thickness:Surface Copper≥35um; Min. Hole Copper: 30um; Average: 35um
Impedance: 50±10%
Surface Treatment: ENIG
Crafts
ARLON PI Material Special Control during Lamination
Impedance Control
Mechanical Depth Routing Control
Protecting Adhesive Covering Connection Conner between Flex and Rigid Tech
Laser Depth Cutting Control
Applications
Mother Board of Aerial Tanker Control System
Parameters
Layers: 12L(4R+4F+4R)
Thicknes: 1.50±0.15mm
Min. Hole Size: 0.18mm
Width/Space: 0.08mm/0.12mm
Surface Treatment: ENIG
Crafts
Applications
Power Electronics
